荷兰专利NL2010799A Charged particle multi-beamlet lithography system and cooling arrangement manufacturing method.

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公开号:NL2010799A
申请号:NL2010799
申请日:2013-05-14
公开日:2013-11-18
发明作者:Johannes Petrus Sprengers；Christiaan Otten；Remco Jager；Stijn Willem Herman Karel Steenbrink；Johan Joost Koning；Willem Henk Urbanus；Alexander Hendrik Vincent Veen
申请人:Mapper Lithography Ip Bv；
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专利说明:

Charged particle multi-beamlet lithography system and cooling arrangement manufacturing method
BACKGROUND OF THE INVENTION
1. Field of the Invention
[0001] The present invention relates to a charged particle multi-beamlet lithography system. The invention further relates to manufacturing a cooling arrangement for use within such lithography system.
2. Description of the Related Art
[0002] In the semiconductor industry, an ever increasing desire exists to manufacture smaller structures with high accuracy and reliability. Lithography is a critical part of such manufacturing process. Currently, most commercial lithography systems use a light beam and mask as a means to reproduce pattern data for exposing a target, such as a wafer with a coating of resist thereon.
In a maskless lithography system, charged particle beamlets may be used to transfer a pattern onto such target. The beamlets may be individually controllable to obtain the desired pattern.
[0003] However, for such charged particle lithography systems to be commercially viable, they need to handle a certain minimum throughput, i.e. the number of wafer being processed per hour should not be too far below the number of wafers per hour that are currently processed with an optical lithography system. Furthermore, the charged particle lithography systems need to meet low error margins. The combination of a relatively high throughput in combination with the requirement to meet low error margins is challenging.
[0004] A higher throughput may be obtained by using more beamlets, and therefore more current. However, handling a greater number of beamlets results in the need for more control circuitry. Furthermore, an increase in the current results in more charged particles that interact with components in the lithography system. Both the circuitry and the impingement of charged particles onto components may cause heating of the respective components within the lithography system. Such heating may reduce the accuracy of the patterning process within the lithography system. In a worst case scenario, such heating may stop one or more components within the lithography system from functioning.
BRIEF SUMMARY OF THE INVENTION
[0005] It is an object of the invention to provide a charged particle multi-beamlet lithography system with improved performance regarding heat management. For this purpose, the invention provides a charged particle multi-beamlet lithography system for exposing a target using a plurality of charged particle beamlets, the system comprising: a beamlet generator for generating the charged particle beamlets; a beamlet modulator for patterning the beamlets to form modulated beamlets, a beamlet projector for projecting the modulated beamlets onto a surface of the target; wherein the beamlet generator, beamlet modulator and/or beamlet projector comprise one or more plates provided with a plurality of apertures for letting the beamlets pass through the plate, the apertures being arranged in groups to form on the surface of the one or more plates a plurality of beam areas distinct and separate from a plurality of non-beam areas containing no apertures for passage of the beamlets; and wherein at least one of the plates with apertures in the lithography system is provided with a cooling arrangement disposed on its surface in one or more non-beam areas, the cooling arrangement comprising a plate-shaped body provided with an inlet for receiving a cooling liquid, a plurality of cooling channels for arranging flow of a cooling liquid therein, and an outlet for removing the cooling liquid. The plate-shaped body of the cooling arrangement is provided with a plurality of slots between the cooling channels, wherein the slots are substantially aligned with the beam areas on the aperture plate surface.
[0006] The term “beam area” refers herein to an area on the surface of the plate (e.g. in the beamlet generator, beamlet modulator, or beamlet projector) wherein apertures are arranged in groups, these apertures being arranged to provide passage for the beamlets. The “non-beam areas” are areas which are not exposed to charged particle beamlets. The disposal of a cooling arrangement in the form of a plate-shaped body onto the aperture plate enables effective cooling in those areas where the cooling arrangement does not interfere with the operation of the lithography system.
[0007] The use of a plurality of cooling channels connected to an inlet and an outlet allows for sufficient supply of cooling liquid in combination with an adequate spatial distribution of the cooling liquid throughout the cooling arrangement while occupying limited space within the lithography system. The plate-shaped body of the cooling arrangement may be formed with a substantially planar portion i.e. a flat surface. In particular, the plate-shaped body may comprise a flat surface that spans a contact plane for connecting to the plate provided with apertures. The flat surface provides an interface region for bringing the plate-shaped body into thermal contact with a flat region of the plate with apertures in such a manner that the flat body surface and the flat plate region are substantially parallel and directly abutting, or substantially parallel and thermally connected via an intermediate layer of thermally conductive material (e.g. an adhesive layer).
[0008] The cooling channels may be arranged mutually parallel to define a flow direction that is parallel with the contact plane. The cooling channels may thus run parallel side by side through the planar portion of the body, and parallel to the plane of the planar portion. The (substantially) parallel alignment may be obtained within the achievable manufacturing and alignment tolerances. A relatively large misalignment for the plate-shaped body and/or channels would be undesirable, for this would significantly perturb the charged particle beam generation and manipulation functions performed by the beamlet generator, beamlet modulator and/or beamlet projector, which in turn would deteriorate the results of lithography. For a lithography system provided with a cooling arrangement with cooling channels and slots in the millimeter range (e.g. according to embodiments described herein below), any deviation from parallel alignment would preferably result in absolute displacements that stay below 0.5 millimeters, more preferably below 100 micrometers.
[0009] The slots enable passage of the charged particle beamlets through the plate-shaped body of the cooling arrangement. Furthermore, the use of a single plate-shaped structure with slots reduces the number of components within the cooling arrangement. Furthermore, suitable alignment of the slots enable contact of the cooling arrangement with the aperture plate at all places where such contact is reasonably possible without interfering with the operation of the lithography system. An increase in contact area may increase the amount of heat the cooling arrangement can absorb. The slots may have an elongate shape along the flow direction, and each slot may lie between two adjacent cooling channels viewed transverse to the flow direction.
[0010] In some embodiments, the inlet and the plurality of cooling channels are connected to each other via a single distribution channel, the single distribution channel comprising a diffuser section for diffusing cooling liquid and a splitting section for dividing the cooling liquid over the plurality of cooling channels, wherein the diffuser section has a first cross-sectional area at a side facing the inlet and a second cross-sectional area facing the plurality of cooling channels; wherein the first cross-sectional area and the second cross-sectional area are equal; and wherein the height of the first cross-sectional area is greater than the height of the second cross-sectional area, the height in a direction perpendicular to a planar portion of the plate-shaped body through which the cooling channels run. The use of such distribution channel allows for the supply of a relatively large amount of cooling liquid at a controllable speed. In some embodiments, the plate-shaped body with the inlet and the outlet are provided entirely on one side of the contact plane spanned by the flat surface.
[0011] In some embodiments, the plate-shaped body of the cooling arrangement is connected to the at least one plate provided with apertures by means of an adhesive layer. The adhesive layer ensures that the entire connected surface of the cooling arrangement can be used for removing heat from the aperture plate. Preferably, the adhesive layer has an overall heat transfer coefficient greater than 100 kW/m K, preferably greater than 150 kW/ m K.
[0012] In some embodiments, the system further comprises a coolant system arranged to provide cooling liquid to the inlet of the cooling arrangement at a sufficiently high flow speed to produce a turbulent flow of cooling liquid through the plurality of cooling channels. A turbulent flow can accommodate more heat from the aperture plate than a laminar flow. Furthermore, an increase of the flow speed reduces the difference in cooling liquid temperature between the exit of a cooling channel and the entrance of that cooling channel.
[0013] In some embodiments, the beamlet modulator comprises a beamlet blanker array and a beamlet stop array, and the plate-shaped body of the cooling arrangement is disposed on a surface of the beamlet blanker array. The beamlet blanker array is subject to significant heating due to the presence of control circuitry to modulate beamlets passing there through.
[0014] In some other embodiments, the coolant system may be arranged for providing cooling liquid to the inlet of the plate-shaped body of the cooling arrangement at a sufficiently low flow speed to produce a laminar flow of cooling liquid through the plurality of cooling channels. A laminar flow introduces fewer vibrations that could jeopardize the performance of the aperture pate that is being cooled. Components that may benefit from a cooling structure being provided with cooling liquid in the laminar flow regime include, but are not limited to the beamlet stop array and a lens plate within the beamlet projector.
[0015] Preferably, the cooling liquid comprises water. Water has sufficient heat capacity and is easier to use than other known cooling liquids, such as ammonia.
[0016] Embodiments of the invention further relate to a method of manufacturing a cooling body for use on top of a surface of a plate provided with a plurality of apertures for use in a multi-beamlet charged particle lithography system. The apertures are arranged in groups to form a plurality of beam areas on the surface of the plate.
[0017] In some embodiments, the method comprises: providing a first plate-shaped body, a surface side of the first body being provided with a first cut-out volume in accordance with a first lay-out; providing a second plate-shaped body, a surface side of the second body being provided with a second cut-out volume in accordance with a second lay-out; providing a plurality of slots in the first and second plate-shaped bodies, wherein the slots are arranged to be aligned with the beam areas on the aperture plate surface, and connecting the surfaces of the first body and the second body onto each other such that the first cut-out volume and the second cutout volume form a plurality of cooling channels within an assembled body, wherein the slots are arranged between the cooling channels, the plurality of cooling channels connecting an inlet at a side of the assembled body with an outlet at another side of the assembled body. Connecting may be performed by providing an adhesive layer between the surfaces of the first body and the second body. Such method is in particular useful if at least one of the first body and the second body comprises Aluminum Nitride.
[0018] In some other embodiments, the method comprises: providing a plate-shaped body, a surface side of the body being provided with a cut-out volume in accordance with a lay-out; providing a plurality of slots in the plate-shaped body, wherein the slots are arranged to be aligned with the beam areas on the aperture plate surface; and covering the cut-out volume so as to form a plurality of cooling channels within the body, wherein the slots are arranged between the cooling channels, the plurality of cooling channels connecting an inlet at a side of the body with an outlet at another side of the body. Covering may include connecting one or more cover plates on the body by means of laser welding. Such embodiment is particularly useful if the body is made of titanium.
[0019] The cut-out volume formed in accordance with the lay-out of the cooling channels, may define a cut-out aperture on a flat surface of the plate-shaped body. The cut-out volume may then be sealed with a cover plate having a shape complementary to the cut-out aperture and arranged to cover the cut/out volume flush with the flat surface, so as to form the plurality of cooling channels on an interior of the body.
[0020] Alternatively, covering may include adhering the aperture plate to be cooled onto the body. Such embodiment is in particular useful for cases in which a laminar flow is desirable. The aperture plate partially forms a wall of the cooling channels which enhances heat transfer between the body and the cooling liquid flowing through the cooling channels.
[0021] It will be evident that the presently invented principle may be set into practice in various manners.
BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Various aspects of the invention will be further explained with reference to embodiments shown in the drawings wherein:
[0023] FIG. 1 is a simplified schematic drawing of an embodiment of a charged particle multi-beamlet lithography system;
[0024] FIG. 2 shows a simplified diagram of an electron optical column according to an embodiment of the invention;
[0025] FIG. 3 shows a schematic cross-sectional view of a portion of a beamlet blanker array provided with a cooling channel;
[0026] FIG. 4A shows an elevated cross-sectional top view of the cooling arrangement;
[0027] FIG. 4B is a cross-sectional view of the cooling arrangement of FIG. 4A;
[0028] FIG. 5 shows a portion of the cooling fluid channel lay-out according to an embodiment of the invention;
[0029] FIG. 6 shows a top view of the cooling fluid channel lay-out of FIG. 5;
[0030] FIGS. 7A, 7B schematically show cross-sectional views of a portion of the cooling arrangement;
[0031] FIGS. 8A, 8B show an elevated bottom and top view of a cooling arrangement according to an embodiment of the invention;
[0032] FIGS. 9A, 9B show an elevated top and bottom view of another cooling arrangement according to an embodiment of the invention; and
[0033] FIGS. 10A, 10B show an elevated top and bottom of the cooling arrangement of FIGS. 9A, 9B disposed on a beamlet stop array.
[0034] FIGS. 1 IA, 1 IB show an elevated bottom and top view of a cooling arrangement according to an alternative embodiment of the invention;
DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS
[0035] The following is a description of various embodiments of the invention, given by way of example only and with reference to the drawings.
[0036] FIG. 1 shows a simplified schematic drawing of an embodiment of a charged particle lithography apparatus 1. Such lithography systems are described for example in U.S. Patent Nos. 6,897,458 and 6,958,804 and 7,019,908 and 7,084,414 and 7,129,502, U.S. patent application publication no. 2007/0064213, and co-pending U.S. patent applications Serial Nos. 61/031,573 and 61/031,594 and 61/045,243 and 61/055,839 and 61/058,596 and 61/101,682, which are all assigned to the owner of the present invention and are all hereby incorporated by reference in their entirety.
[0037] In the embodiment shown in FIG. 1, the lithography apparatus 1 comprises a beamlet generator 2 for generating a plurality of beamlets, a beamlet modulator 8 for patterning the beamlets to form modulated beamlets, and a beamlet projector for projecting the modulated beamlets onto a surface of a target 13. The beamlet generator 2 typically comprises a source 3 for producing a charged particle beam 4. In FIG. 1, the source 3 produces a substantially homogeneous, expanding charged particle beam 4. Hereafter, embodiments of the invention will be discussed with reference to an electron beam lithography system. Therefore, source 3 may be referred to as electron source 3 and beam 4 may be referred to as electron beam 4. It must be understood that a similar system as depicted in FIG. 1 may be used with a different type of radiation, for example by using an ion source for producing an ion beam.
[0038] In the embodiment shown in FIG. 1, the beamlet generator 2 further comprises a collimator lens 5 for collimating the electron beam 4 produced by the electron source 3, and an aperture array 6 for forming a plurality of beamlets 7. The collimator lens 5 may be any type of collimating optical system. Before collimation, the electron beam 4 may pass a double octopole (not shown). Preferably, the aperture array 6 comprises a plate provided with a plurality of through holes. The aperture array 6 blocks part of the electron beam 4, whereas a portion of the electron beam 4 passes the aperture array 6 through the holes so as to produce the plurality of electron beamlets 7. The system generates a large number of beamlets 122, preferably about 10,000 to 1,000,000 beamlets.
[0039] The beamlet modulator or modulation system 8 in the embodiment of FIG. 1 comprises a beamlet blanker array 9 and a beamlet stop array 10. The beamlet blanker array 9 comprises a plurality of blankers for deflecting one or more of the electron beamlets 7. The deflected and undeflected electron beamlets 7 arrive at beam stop array 10, which has a plurality of apertures. The beamlet blanker array 9 and beam stop array 10 operate together to block or let pass the beamlets 7. Generally, if beamlet blanker array 9 deflects a beamlet 7, it will not pass through the corresponding aperture in beam stop array 10, but instead will be blocked. However, if beamlet blanker array 9 does not deflect a beamlet 7, then it will pass through the corresponding aperture in beam stop array 10. Alternatively, beamlets 7 may pass the beamlet stop array 10 upon deflection by corresponding blankers in the beamlet blanker array 9 and be blocked by the beamlet stop array 10 if they are not deflected. To focus the beamlets 7 within the plane of the blanker array 9 the lithography system 1 may further comprise a condenser lens array 20.
[0040] The beamlet modulator 8 is arranged to provide a pattern to the beamlets 7 on the basis of pattern data input provided by a control unit 60. The control unit 60 comprises a data storage unit 61, a read out unit 62 and a data conversion unit 63. The control unit 60 may be located remotely from the rest of the system, for example outside the clean room. The pattern data may be transferred via optical fibers 64. The light transmitting ends of the optical fibers 64 may be assembled in one or more fiber arrays 15. The pattern data carrying light beams 14 are then projected onto corresponding light receiving elements, such as photodiodes, provided on the beamlet blanker array 9. Such projection may be done directly, or via projection system, in FIG.
1 schematically represented by projection lenses 65. One or more elements in such projections system, such as projection lenses 65, may be moveable under control of the control unit 60 via a positioning device 17 to enable proper alignment and/or focusing of the data carrying light beams 14 onto the corresponding light sensitive elements in the beamlet blanker array 9.
[0041] The light sensitive elements are coupled to one or more blankers and are arranged to convert the light signal into a different type of signal, for example an electric signal. A pattern data carrying light beam 14 may carry data for one or more blankers within the beamlet blanker array 9. The pattern data is thus sent via the pattern data carrying light beams towards the blankers to enable the blankers to modulate the charged particle beamlets 7 passing there through in accordance with a pattern.
[0042] The modulated beamlets coming out of the beamlet modulator 8 are projected onto a target surface of a target 13 by the beamlet projector. The beamlet projector comprises a beamlet deflector array 11 for scanning the modulated beamlets over the target surface and a projection lens arrangement 12 comprising one or more arrays of projection lenses for focusing the modulated beamlets onto the target surface. The target 13 is generally positioned on a moveable stage 24, which movement may be controlled by a control unit such as control unit 60.
[0043] For lithography applications, the target usually comprises a wafer provided with a charged-particle sensitive layer or resist layer. Portions of the resist film will be chemically modified by irradiation of the beamlets of charged particles, i.e. electrons. As a result thereof, the irradiated portion of the film will be more or less soluble in a developer, resulting in a resist pattern on a wafer. The resist pattern on the wafer can subsequently be transferred to an underlying layer, i.e. by implementation, etching and/or deposition steps as known in the art of semiconductor manufacturing. Evidently, if the irradiation is not uniform, the resist may not be developed in a uniform manner, leading to mistakes in the pattern. High-quality projection is therefore relevant to obtain a lithography system that provides a reproducible result.
[0044] The deflector array 11 and the projection lens arrangement 12 may be integrated into a single end module. Such end module is preferably constructed as an insertable, replaceable unit. The insertable, replaceable unit may also include the beamlet stop array 10.
[0045] The deflector array 11 may take the form of a scanning deflector array arranged to deflect each beamlet 7 that passes through the beamlet stop array 10. The deflector array 11 may comprise a plurality of electrostatic deflectors enabling the application of relatively small driving voltages. Although the deflector array 11 is drawn upstream of the projection lens arrangement 12, the deflector array 11 may also be positioned between the projection lens arrangement 12 and the target surface 13.
[0046] The projection lens arrangement 12 may thus be arranged to focus the beamlets 7 before or after deflection by the deflector array 11. Preferably, the focusing results a geometric spot size of about 10 to 30 nanometers in diameter. In such preferred embodiment, the projection lens arrangement 12 is preferably arranged to provide a demagnification of about 100 to 500 times, most preferably as large as possible, e.g. in the range 300 to 500 times. In this preferred embodiment, the projection lens arrangement 12 may be advantageously located close to the target surface 13.
[0047] The charged particle lithography apparatus 1 operates in a vacuum environment. A vacuum is desired to remove particles which may be ionized by the charged particle beams and become attracted to the source, may dissociate and be deposited onto the machine components, and may disperse the charged particle beams. A vacuum of at least 10"6 bar is typically required. Preferably, all of the major elements of the lithography apparatus 1 are housed in a common vacuum chamber, including the beamlet generator 2 including the charged particle source 3, the beamlet modulator 8, the beamlet projector system, and the moveable stage 24. These major elements are also referred to as the electron-optical column, or simply as the column, and is schematically represented by the dashed box 18 in FIG. 1.
[0048] In an embodiment the charged particle source environment is differentially pumped to a considerably higher vacuum of up to 10"10 mbar. In such embodiment, the source 3 may be located in a separate chamber, i.e. a source chamber. Pumping down the pressure level in the source chamber may be performed in the following way. First, the vacuum chamber and the source chamber are pumped down to the level of the vacuum chamber. Then the source chamber is additionally pumped to a desired lower pressure, preferably by means of a chemical getter in a manner known by a skilled person. By using a regenerative, chemical and so-called passive pump like a getter, the pressure level within the source chamber can be brought to a lower level than the pressure level in the vacuum chamber without the need of a vacuum turbo pump for this purpose. The use of a getter avoids the interior or immediate outside vicinity of the vacuum chamber being submitted to acoustical and/or mechanical vibrations as would be the case if a vacuum turbo pump or similar would be used for such a purpose.
[0049] FIG. 2 shows a simplified diagram of an electron optical column according to an embodiment of the invention. In FIG. 2, a group of beamlets is depicted as a single beam 27.
The group of beamlets 27 passes through an aperture array 6 and subsequently through one or more condenser lens arrays 20 until the group 27 arrives at a beamlet blanker array 9. The beamlet blanker array 9 may comprise an aperture array, which then forms an integral part of the blanker array 9. Alternatively, such aperture array may be a separate array being positioned upstream the blanker array 9. The use of an additional aperture array upstream of the blanker array 9 reduces the heat load of the blanker array 9.
[0050] The beamlet blanker array 9 is divided into beam areas 91 and non-beam areas 92.
The beam areas 91 are areas provided with apertures and are arranged to receive and modulate beamlets passing through these apertures. The non-beam areas 92 are areas which are not exposed to charged particle beamlets. These non-beam areas 92 are arranged to provide an area for components needed to support the components within the beam areas 91. For example, the non-beam areas 92 may accommodate light sensitive elements, such as photodiodes, for receiving data pattern carrying or modulated light signals, and electrical connections via which the light signals may be forwarded to modulators within the beam areas 91.
[0051] In the embodiment depicted in FIG. 2 components such as photodiodes and electrical circuits in the non-beam areas are placed at a surface side of the blanker array 9 facing away from the source 3, hereafter referred to as the target side of the blanker array 9. On the surface side of the blanker array 9 facing the source 3, hereafter the source side of the blanker array 9, a cooling arrangement 93 is provided. The cooling arrangement 93 comprises one or more cooling channels for accommodating a flow of a cooling fluid, such as water, and water flowing in the channels can be placed on an upper surface of non-beam areas 92. The cooling arrangement 93 is located within the non-beam areas 92 of the blanker array 9 to avoid that any components thereof may block or directly interact with charged particles from the group of beamlets 27.
[0052] The cooling arrangement 93 may be coupled to a coolant system 25 for providing cooling fluid to the inlet of the cooling arrangement at a suitable speed. In some embodiments, in particular if maximum use is to be made of the cooling capacity of the cooling fluid, such flow speed should be sufficiently high to produce a turbulent flow of cooling fluid through the plurality of cooling channels. However, if the operation of the structure to be cooled is very sensitive for vibrations, the coolant system may be arranged to provide the cooling fluid with a sufficiently low flow speed to produce a laminar flow of cooling fluid through the plurality of cooling channels. The cooling arrangement 93 may also include measures to create a certain type of flow, e.g. a turbulent flow or a laminar flow.
[0053] With reference to FIGS. 3-8, embodiments of the invention will be discussed in which a cooling arrangement is disposed on top of a beamlet blanker array 9. Additionally, with reference to FIGS. 9 and 10, embodiments of the invention will be discussed in which a cooling arrangement is disposed on top of a beamlet stop array. However, it must be understood, as will be apparent from the column shown in FIG. 2, that such cooling arrangement may be provided on surface of other components within the electron optical column. In particular, embodiments of the cooling arrangement may be used on a surface of a plate provided with a plurality of apertures for letting the beamlets pass through the plate. Examples of such plates include but are not limited to an aperture array such as aperture array 6, a lens plate such as a plate that is part of the one or more condenser lens arrays 20 or a plate that is part of the projector lens arrangement 12 shown in FIG. 1, and a plate in a beamlet modulator 8, such as beamlet blanker array 9 and/or beamlet stop array 10. The apertures do not need to be current limiting apertures. In some cases, heat may be generated by other means than impingement of charged particles within the charged particle beamlets. For example, the beamlet blanker array 9 comprises electronic circuitry that generates heat. Furthermore, charged particles may scatter upon components resulting in secondary charged particles which may transfer energy to other components as well.
[0054] The cooling fluid preferably comprises water. Water is easier to use than other known cooling fluids, such as ammonia. Ammonia requires a high pressure system and more extensive safety measures. In principle, a liquid metal, such as liquid gallium, could also be used, however water has a much larger allowable flow speed range than gallium, and the use of gallium introduces other complications such as solidification, cost, corrosivity, and diffusion. In case of water, a suitable temperature at the inlet 31 appears to be 15-25 °C, preferably about 20 °C.
[0055] FIG. 3 shows a schematic cross-sectional view of a portion of a beamlet blanker array 9 provided with a cooling channel 94 that is part of the cooling arrangement 93. The cooling channel 94 is arranged to accommodate a flow of a cooling fluid 96. Preferably, the flow is a forced flow by an external source, i.e. coolant system 25 in FIG. 2, to obtain forced convection in the cooling channel 94.
[0056] The cooling arrangement 93 is connected to the beamlet blanker array 9 by means of an adhesive layer 97. Preferably, the adhesive being used in the adhesive layer 97 has a sufficiently high thermal conductivity to provide as much cooling capacity as possible. Preferably, the adhesive layer has a heat transfer coefficient greater than 100 kW/m · K, more preferably greater than 150 kW/ m K.
[0057] Heat transfer via the cooling fluid within the cooling arrangement 93 improves the role of the arrangement 93 in removing heat away from the beamlet blanker array 9 so as to keep the beamlet blanker array 9 below a threshold temperature. The extent of heat transfer between a side wall 95 of the cooling channel 94 and the cooling fluid 96 can be indicated by a heat transfer coefficient. Experiments have shown that the heat transfer coefficient generally increases with the flow speed of cooling fluid 96 in the channel.
[0058] Another advantage of a relatively high flow speed of cooling fluid 96 in the channel 94 is that such speed reduces the temperature difference AT between the temperature of the cooling fluid at entry of the channel 94 and the temperature of the cooling fluid at the exit of the channel 94. As a result, the heat absorbing capacity of the cooling fluid does not change significantly as a function of channel position, and cooling can be effected in a more homogeneous way.
[0059] However, for some components within a lithography system, requirements regarding cooling are of somewhat less importance than requirements with respect to other parameters, such as vibrational influences. For such components, it may be preferable to have a relatively low speed. In some embodiments, the flow speed may be such that the fluid flow is a laminar flow. The use of a laminar flow reduces the generation of vibrations caused by interaction between the cooling fluid 96 and the cooling arrangement 93. Furthermore, the corrosion erosion is much lower for a laminar flow than for a turbulent flow.
[0060] As far as cooling is concerned, a turbulent flow is more preferable than a laminar flow. In a truly laminar flow, there is no flow component perpendicular to the channels walls, so any heat transfer in that direction occurs solely via much less efficient conduction in the cooling fluid. However, in a turbulent flow heat will be transferred in a direction perpendicular to the channel walls. Consequently, the cooling fluid can absorb more heat.
[0061] Considering the limitations of the geometries involved, convection is the ideal mechanism to transfer heat away from the optical component in an effective way. Although conductive heat transfer will always occur to some extent, convective heat transfer is generally dominant.
[0062] Furthermore, the cooling arrangement 93 is preferably made of a material that has a coefficient of thermal expansion (CTE) that is similar, or at least not too different, from the CTE of the beamlet blanker array material. A too large difference in CTE between the cooling arrangement material and the beamlet blanker array material may cause deformation of the beamlet blanker array. Furthermore, the adhesive layer preferably has a CTE that is not too different as well to ensure that the cooling arrangement 93 and the beamlet blanker array 9 remain at substantially the same position with respect to each other in case the beamlet blanker array expands due to exposure to heat originating from impingement of charged particles on its source surface side. Furthermore, the beamlet blanker array 9 may expand as a result of heat used in circuitry within the non-beam areas.
Table 1 CTE of different materials
[0063] Table 1 illustrates CTEs of different materials. In many embodiments, the beamlet blanker array material will be silicon. As follows from Table 1, silicon has a CTE of 2.6 pm/m-K. Typical materials for a cooling arrangement 93 would be copper (Cu), tungsten (W), aluminum nitride (AIN) and titanium (Ti). As follows from Table 1, of these materials copper is
the least suitable to be used for a cooling arrangement that is provided on a silicon beamlet blanker array, because the CTE of copper is by far the highest, i.e. 16.5 pm/m-KA
[0064]
[0065] FIG. 4A shows an elevated cross-sectional top view of the cooling arrangement 93 without cooling fluid flowing there through. The cooling channels 94 in the cooling arrangement 93 are generally closed cooling channels, i.e. channels entirely surrounded by side walls along their length. In FIG. 4A, a cover for covering the different components of the cooling arrangement, for example to serve as a side wall for cooling channels 94, is not shown for clarity reasons. Such cover prevents that cooling fluid can leak out of the cooling arrangement 93. The cooling arrangement 93 comprises a flat surface 37 for connecting to the plate with apertures to allow the flat surface 37 to function as a heat transfer surface. The cooling arrangement 93 is provided on the surface side 37 with two cut-out volumes in accordance with the lay-out of the cooling channels 94. The perimeters for the cut-out volumes define cut-out apertures 38/The cooling arrangement 93 is provided with one or more inlets 31 for receipt of cooling fluid and one or more outlets 35 for removal of cooling fluid. The cooling fluid flows from the one or more inlets 31 towards the one or more outlets 35 through a cooling channels 94 while capturing heat along the way. Preferably, the number of cooling channels 94 exceeds the number of inlets 31 and outlets 35. Further details with respect to this design will be discussed with reference to FIGS. 5 and 6.
[0066] To avoid that the cooling arrangement 93 interferes with the charged particle beamlets, the cooling arrangement 93 is provided with slots 34 that are positioned over beam areas of the beamlet blanker array 9. By suitably aligning the slots 34 with respect to the beam areas of the blanker array 9 the cooling arrangement may cover and be in contact with the blanker array over most, preferably all, surface area reserved for the non-beam areas.
[0067] FIG. 4B is a cross-sectional view of the cooling arrangement 93 depicted in FIG. 4A along the line IVb - IVb’. Preferably, the cooling arrangement 93 does not occupy too much space. Preferably, the cooling arrangement 93 should not interfere with the optimal position of other components within the electron optical column. That is, in many cases the height of the cooling arrangement is restricted so to avoid that an adjacent component in the electron optical column, i.e. a component upstream if the cooling arrangement is arranged at the source side of the blanker array 9 or a component downstream if the cooling arrangement is arranged at the target side of the blanker array 9, can not be positioned at its desired position. That is, electron optical components in the electron optical column are generally placed in such a way that their influence on the charged particle beamlets is optimal for the electron optical performance of the column. For example, in the embodiment shown in FIG. 2, the dimensions of the cooling arrangement 93 are limited by the presence of the condenser lens array 20.
[0068] In the embodiment shown in FIG. 4B, the height di of the cooling channels 94 on top of the beamlet blanker array 9 is limited in view of abovementioned reason. However, because there may be more space available at the side of the beamlet blanker array 9 the height of cooling channel or reservoir 36 connected to the inlet 31 may be higher. A similar height di may be used in a cooling channel or reservoir connected to the outlet 35. The use of a greater height di at locations where such space is available has the advantage that a sufficient amount of cooling fluid can be provided and/or removed. At the same time, the presence of multiple cooling channels of limited height ensures that the beamlet blanker array can be sufficiently cooled. Exemplary dimensions for heights di and di are 1-3 mm, e.g. 1.7 mm, and 3-10 mm, e.g. 4.0 mm, respectively.
[0069] FIG. 5 shows a portion of the cooling fluid channel lay-out according to an embodiment of the invention. The inlet 31 is connected to the plurality of cooling channels 94 via a single distribution channel or tube. The single distribution channel comprises a diffuser section 41 for diffusing cooling fluid and a splitting section 42 for dividing the cooling fluid over the plurality of cooling channels 94. Dividing the cooling fluid flow over multiple channels 94 allows to spread resistance caused by a turbulent fluid flow.
[0070] FIG. 6 shows a top view of the cooling fluid channel lay-out of FIG. 5. As can be seen in FIG. 5 the height of the cooling channel lay-out is higher at a position close to the inlet 31 than at a position close to the plurality of cooling channels 94. As mentioned earlier, the space available for the cooling channels 94 may be limited. However, the fluid is preferably supplied at a velocity sufficiently high to create a turbulent flow through the cooling channels 94, for example by using a coolant system 25 as depicted in FIG. 2.
[0071] To accommodate a fluid with a high velocity, preferably the cooling arrangement 93 is thicker at locations further away from beam areas, and the inlet 31 is then located in such thicker portion. The inlet 31 may then have a relatively large cross-sectional area. The diffuser section allows the fluid to diffuse in such a way that the flow can be spread as homogeneously as possible over the plurality of cooling channels within the splitting section 42. The cross-sectional area of the flow path at entry of the diffuser section is preferably the same as the cross-sectional area of the flow path at the exit of the diffuser section exit. Such dimensioning ensures that the cooling fluid enters and exits the diffuser section 41 at substantially the same velocity. In FIG. 6, the dimensions may thus be such that for a rectangular cross-section d times the height at entry equals dn times the height at the exit of the diffuser section.
[0072] In some embodiments, for example the embodiment with a layout as depicted in FIG.
6, the cross-sectional areas of the one or more channels being substantially aligned with the inlet have smaller dimensions than the cross-sectional areas of channels that are more offset with respect to the inlet. In FIG. 6, under the assumption that all channels have the same height, the center channel has a diameter <7m that is smaller than the diameter ds of the side channels. The use of different cross-sectional areas may help to evenly spread fluid resistance over the multiple channels 94.
[0073] The cooling arrangement 93 is manufactured by assembling multiple bodies onto each other. The size and shape of the bodies may depend on the materials being used, the method of assembly and the dimensions at hand. FIGS. 7A, 7B schematically show cross-sectional views of a portion of the cooling arrangement 93, in this case a channel 94 prior to assembly.
[0074] The cooling arrangement 93 of FIG. 7A is manufactured by assembling two bodies 93a, 93b onto each other. Both bodies 93a, 93b are shaped such that a significant portion of a channel is formed therein, in this case the cut-out area in each body 93a, 93b contributes for about 50% to the channel(s) being formed. In the shown embodiment, the two bodies 93a, 93b are connected to each other with an adhesive in areas 51. Such assembly is effective if the bodies 93a, 93b are made of AIN.
[0075] The cooling arrangement 93 of FIG. 7B is also manufactured by assembling two bodies 93a, 93b. However, in this case the first body 93a contributes primarily to the channel, while the second body 93b only serves to close the channel. In this case, the second body 93b may be connected to the first body 93a by laser welding in area 52. The area 52 is bounded by the edge of the cut-out aperture 38. Such assembly may be used if titanium is used as the cooling arrangement material.
[0076] FIGS. 8A, 8B show an elevated bottom and top view of a cooling arrangement 93 according to an embodiment of the invention. In this embodiment, the cooling arrangement has been made in accordance with the assembly technique shown in FIG. 7B. This embodiment of the cooling arrangement 93, which is similar to the embodiment described with reference to FIG.4A, is formed by a flat body provided with six cooling channels 94 that are separated by five slots 34. These slots 34 are configured to be positioned over beam areas of the plate provided with apertures (e.g. the beamlet blanker array 9 or the beamlet stop array 10 of the lithography system) in such a manner that interference by the cooling arrangement 93 with charged particle beamlets is avoided. By suitably aligning the slots 34 with respect to the beam areas of the plate, the cooling arrangement 93 may cover and be in contact with the plate over most, preferably all, surface area that is reserved for the non-beam areas.
[0077] The cooling arrangement 93 in FIGS.8A and 8B may be manufactured by joining a first body 93a with two second bodies 93b. The first body is formed as a plate-shaped body 93a provided with the six cooling channels 94 and the five slots 34. The plate-shaped body 93a is preferably made from titanium. The plate-shaped body 93a comprises a flat surface 37 that spans a contact plane P for connecting to the plate with apertures, so as to allow the flat surface 37 to function as a heat transfer surface. The six cooling channels 94 are arranged co-planar and (substantially) mutually parallel to define a flow direction F. The plane spanned by the six cooling channels 94 is substantially parallel with the flat surface side 37 and thus with the contact plane P. Each cooling channel 94 is along at least one side thereof (as viewed in the flow direction F) bounded by one slot 34. Each slot 34 has an elongate shape along the flow direction F i.e. parallel with the cooling channels 94. The cooling arrangement 93 in FIGS.8A and 8B is provided with two inlets 31 for receiving cooling fluid into the cooling arrangement 93, and two outlets 35 for discharging cooling fluid from the cooling arrangement 93. During cooling operation, the cooling fluid flows from the two inlets 31 towards the two outlets 35 through the cooling channels 94, while extracting thermal energy from the plate with apertures along the way. The cooling arrangement 93 is thicker at outer regions 39 of the plate shaped body 93a, this thickness corresponding to a direction perpendicular to the contact plane P. The inlets 31 and the outlets 35 are located in the thicker outer regions 39, and allow the inlets 31 and the outlets 35 to have cross-sectional areas that are larger than the cross-sectional areas of the cooling channels 94. The inlets 31 and outlets 35 also run substantially parallel to the flow direction F, thereby minimizing any obstruction of the fluid flow. One inlet 31 is connected to three cooling channels 94 via a single distribution channel, which comprises a diffuser section 41 and a splitting section 42 as was described with reference to FIGS.5 and 6. The outlet 35 is similarly provided with a three-way distribution channel. In the resulting channel lay-out, the distribution channel of each of the two inlets 31 splits up into three cooling channels 94, and these three cooling channels 94 subsequently merge back into the distribution channel of one of the two outlets 35. The channel lay-out in this cooling arrangement 93 may be used in similar cooling arrangements having n x 3 (n = 1, 2, 3,..) cooling channels 94, and n inlets 31 and outlets 35.
[0078] The plate-shaped body 93a with the two inlets 31 and the two outlets 35 is provided entirely on one side of the contact plane P (i.e. in the first half space). As a result, the flat surface side 37 can be attached at the other side of the contact plane P (i.e. in the other half space) as a heat transfer surface to any desired portion of the plate with apertures in the lithography system (e.g. the beamlet blanker array 9 or the beamlet stop array 10), without obstruction by any other portion of the cooling arrangement 93.
[0079] The plate-shaped body may be obtained by providing the first body 93a on the surface side 37 with two cut-out volumes in accordance with the lay-out of the cooling channels 94. A perimeter of each cut-out volume near the surface side 37 defines a cut-out aperture 38 (see FIG.4A). The resulting two cut-out apertures 38 are covered by the second bodies 93b, which are formed by cover plates that each has a shape which is similar to the cut-out apertures 38, and which is arranged to cover the cut-out volume flush with the flat surface side 37. The two cover plates 93b are positioned over the two cut-out apertures 38, so as to form the cooling channels 94 in accordance with the assembly technique illustrated by FIG. 7B. The cooling channels 94 may thus be formed to define a channel lay-out with rectangular cross-sections (viewed perpendicular to the flow direction F). The described assembly technique is particularly suitable for manufacturing this rectangular channel lay-out. The cover plates 93b may be connected to the first body 93a by laser welding the respective cover plate 93b along the contour of the corresponding cut-out aperture 38. The cover plates 93b are preferably also made from titanium. The technique of providing the cut-out volumes in the plate shaped body 93a and covering the cut-out volumes with the cover plates 93b on the flat surface side 37 yields an optimal balance between good heat transfer properties on the one hand and good manufacturing accuracy on the other hand. This applies in particular for cooling arrangements 93 having dimensions in the order of several (tens of) millimeters (e.g. the values for d and d} described herein above). Typical lengths for the cooling channels 94 and the slots 34 (viewed along the flow direction F) may for example be in the range of 25 millimeters to 50 millimeters, preferably 37 millimeters. Typical external widths of the cooling channels 94 (transversal to the flow direction F) may be 3 millimeters to 4 millimeters, preferably 3.5 millimeters, and typical internal widths of the cooling channels 94 may be 2 millimeters to 3 millimeters, preferably 2.5 millimeters. Typical widths of the slots 34 may be 2 millimeters to 3 millimeters, preferably 2.5 millimeters.
[0080] FIGS. 9A, 9B show an elevated top and bottom view of another cooling arrangement 93’ according to an embodiment of the invention. The cooling arrangement 93’ also includes a plurality of cooling channels 94 connecting an inlet 31 with an outlet 35. However, in this embodiment the cooling channels 94 in the cooling arrangement 93’ have an open structure, as is shown in FIG. 9B.
[0081] The cooling arrangement 93’ comprises a distribution channel 43 connecting the inlet 31 with the plurality of cooling channels 94, the distribution channel 43 being arranged for receiving the cooling fluid 31 from the inlet 31, for example supplied via a coolant system 25, and guiding the cooling fluid in such a way that the cooling fluid is transferred through the cooling channels 94 in a laminar flow regime. As a result of the laminar flow, the cooling fluid may have a negligible influence on the structure to be cooled with respect to vibrations.
[0082] The inlet 31 and the outlet 35 are preferably placed diagonally with respect to the orientation of the cooling channels 94 between the beam areas to reduce cooling inhomogeneity as a function of location caused by a somewhat higher temperature difference between the cooling fluid at cooling channel entry and the cooling fluid at cooling channel exit as compared to such temperature difference in case of a high-speed, turbulent flow.
[0083] FIGS. 10A, 10B show an elevated top and bottom of the cooling arrangement 93’ of FIGS. 9A, 9B disposed on a beamlet stop array 10. By attaching the beamlet stop array 10 directly onto the cooling arrangement 93’, the cooling channels 94 are closed, and leakage of cooling fluid out of the combination of the cooling arrangement 93’ and the beamlet stop array 10 may be avoided. The cooling arrangement 93’ may in particular also be useful to cool vibrationally sensitive components within a lithography system, for example a critical lens plate of a projection lens array in a beamlet projector.
[0084] FIGS. 11A and 1 IB show an elevated bottom and top view of another cooling arrangement 93” according to embodiment of the invention. The cooling arrangement 93” represents an alternative to the embodiment described with reference to FIGS.8A and 8B, and a majority of features in the cooling arrangement 93 described there may also be present in the cooling arrangement 93” shown in FIGS.l 1A and 1 IB. These features will not be discussed here again. For the features that are discussed here, similar reference numbers are used for similar features, but indicated by primes to distinguish the embodiments.
[0085] The cooling arrangement 93” is again formed by a flat body provided with six cooling channels 94” that are separated by five slots 34” configured for positioning over plate beam areas. In this case, the cooling arrangement 93” is provided with a single inlet 31” for receiving of cooling fluid, and a single outlet 35” for discharging the cooling fluid. During operation, the cooling fluid flows from the inlet 31” towards the outlet 35” through the six cooling channels 94” along flow direction F”. The cooling fluid flowing through the cooling channels 94” may collect thermal energy along the way that may for example originate from a hot planar object that is connected to the flat surface side 37” along the contact plane P”. Again, the cooling arrangement 93” is thicker at outer regions 39” of the plate-shaped body 93a”, and the inlet 31” and the outlet 35” are located in these thicker outer regions 39”. The inlet 31” is connected to the six cooling channels 94” via a two-staged distribution channel. The two-staged distribution channel of the inlet 31” comprises a diffuser section (41”) for diffusing cooling fluid, and a splitting section (42”) for dividing the cooling fluid over the cooling channels 94”, these sections being similar to the ones in the distribution channel as described herein above with reference to FIGS.5 and 6. In the splitting section, the inlet channel 31” initially branches off into three channels that each comprises a divergent section 40”. These divergent sections 40” preferably diverge (i.e. increase the channel cross-section perpendicular to the flow direction while proceeding along the flow direction) with a smooth lateral curvature, to expand the respective channel and generate a gradual decrease in the flow velocity. The expanded portions of the channels are formed analogous to what has been explained with reference to FIG.6 i.e. the middle initial channel (which is substantially aligned with the inlet 31) has a smaller cross-sectional area than the cross-sectional areas of the outer initial channels (which are more offset with respect to the inlet 31). Each channel subsequently splits up into two adjacent cooling channels 94” that are laterally separated by a slot 34”. At the other end of the slots 34” (viewed along the flow direction F”), each of the adjacent pairs of cooling channels 94” subsequently merges back into a further channel. Each of the three further channels comprises a convergent section 44”, which is preferably formed by a smooth lateral narrowing of the channel. The three further channels join into the outlet channel 35” by means of a two-staged distribution channel complementary to the one provided at the inlet 31”.
[0086] The plate-shaped body 93a” may be obtained by providing a single cut-out volume in accordance with a lay-out of the six cooling channels 94” on the flat surface side 37”, and may also be manufactured in accordance with the technique illustrated by FIG.7B. A perimeter of the cut-out volume near the surface side 37” defines a single cut-out aperture. The resulting cut-out aperture is covered by a cover plate 93b” that has a shape matching the contour of the cut-out aperture, in such a manner that the cover plate 93b” can be positioned flush with the flat surface side 37”. This cooling channel 94” lay-out requires only a single cut-out volume, and allows connection to single conduits for the supply and discharge of cooling fluid. The channel lay-out in this cooling arrangement 93” is particularly suitable for application in similar cooling arrangements having n x 6 (n = 1, 2, 3, ...) cooling channels 94”, and n inlets 31” and outlets 35”. Preferably, the inlet 31” and the outlet 35” each have a cross-sectional area that equals the sum of the cross-sectional areas of the cooling channels 94”.
[0087] The invention has been described by reference to certain embodiments discussed above. It will be recognized that these embodiments are susceptible to various modifications and alternative forms well known to those of skill in the art without departing from the spirit and scope of the invention. Accordingly, although specific embodiments have been described, these are examples only and are not limiting upon the scope of the invention, which is defined in the accompanying claims.

权利要求:
Claims (19)
[1]
A charged-particle multi-beamlet lithography system (1) for illuminating a target (13) using a plurality of charged particle beamlets (7), the system comprising: - a beamlet generator (2) for generating the charged particle beamlets; - a beamlet modulator (8) for patterning the beamlets to form modulated beamlets; - a beamlet projector (12) for projecting the modulated beamlets on a surface of the target; wherein the beamlet generator, beamlet modulator and / or beamlet projector comprises one or more plates, provided with a plurality of apertures for allowing the beamlets to pass through the plate, the apertures being arranged in groups to provide a surface on the surface of the one or more plates forming a plurality of bundle areas (91) that are isolated and separated from a plurality of non-bundle areas (92) that have no openings for passage of the beamlets; and wherein at least one of the plates with apertures in the lithography system is provided with a cooling device (93) located on its surface in one or more non-bundle areas, the cooling device comprising a plate-shaped body provided with an inlet (31) ) for receiving a cooling fluid, a plurality of cooling channels (94) adapted to flow a cooling fluid therein, and an outlet (35) for removing the cooling fluid, the plate-shaped body being provided with a plurality of slots (34) between the cooling channels, and wherein the slots are substantially aligned with the beam regions on the surface of the apertured plate.
[2]
The system of claim 1, wherein the inlet and the plurality of cooling channels are connected to each other via a single distribution channel, the single distribution channel having a diffuser section (41) for distributing the cooling fluid and a distribution section (42) for distributing comprising the cooling fluid over the plurality of cooling channels (94), the diffuser section having a first cross-sectional area on one side facing the inlet (31) and a second cross-sectional area, facing the plurality of cooling channels; wherein the first cross-sectional area and the second cross-sectional area are equal; and wherein the height of the first cross-sectional area is greater than the height of the second cross-sectional area, the height being defined in a direction perpendicular to a flat portion of the plate-shaped body through which the cooling channels run.
[3]
The system according to claim 1 or 2, wherein the plate-shaped body comprises a flat surface (37) that surrounds a contact surface (P) for connection to the apertured plate, the cooling channels (94) being placed mutually substantially parallel to one another define a flow direction (F) that is substantially parallel to the contact surface (P).
[4]
The system according to any of the preceding claims, wherein the plate-like body of the cooling device is connected by means of an adhesive layer (97) to the at least one plate provided with openings.
[5]
The system of claim 4, wherein the adhesive layer (97) has a total heat transfer coefficient of more than 100 kW / m2-K, preferably more than 150 kW / m2-K.
[6]
The system of any one of the preceding claims, further comprising a cooling system (25) adapted to provide cooling fluid at the inlet of the cooling device with a sufficiently high flow rate to produce a turbulent flow of cooling fluid through the plurality of cooling channels.
[7]
The system according to any of the preceding claims, wherein the beamlet modulator comprises a beamlet blanker array (9) and a beamlet stop array (10), and wherein the plate-shaped body of the cooling device is located on a surface of the beamlet blanker array.
[8]
The system of any one of claims 1 to 5, further comprising a cooling system (25) for providing cooling fluid at the inlet of the cooling device with a sufficiently low flow rate to produce a laminar flow of cooling fluid through the plurality of cooling channels .
[9]
The system of claim 8, wherein the beamlet modulator comprises a beamlet blanker array (9) and a beamlet stop array (10), and wherein the plate-shaped body of the cooling device is located on a surface of the beamlet stop array.
[10]
The system of claim 8, wherein the plate-shaped body of the cooling device is located on a surface of a plate with openings of the beamlet projector.
[11]
The system of any one of the preceding claims, wherein the cooling fluid comprises water.
[12]
The system of any one of the preceding claims, wherein the plate-shaped body of the cooling device is made of titanium.
[13]
A method for manufacturing a heat sink for use on top of a surface of a plate, provided with a plurality of apertures for use in a multi-beamlet lithography system based on charged particles, the apertures being arranged in groups to form a plurality of beam regions (91) forming on the surface of the plate, the method comprising: - providing a plate-shaped body, wherein a surface side (37) of the body is provided with a cut-out volume in accordance with a design; - providing a plurality of slots (34) in the plate-shaped body with the slots arranged to align with the beam regions on the surface of the plate with openings; - covering the cut-out volume to form a plurality of cooling channels (94) in the body, the slots (34) being located between the cooling channels (94), the plurality of cooling channels having an inlet on one side of the connecting the body to an outlet on another side of the body.
[14]
The method of claim 13, wherein the covering comprises connecting one or more cover plates to the body by laser welding.
[15]
The method of claim 13 or 14, wherein the body is made of titanium.
[16]
The method of claim 13, wherein the covering comprises bonding the plate with openings to be cooled on the body.
[17]
A method of manufacturing a heat sink for use on top of a surface of a plate, provided with a plurality of apertures for use in a multi-beamlet lithography system based on charged particles, the apertures being arranged in groups around a plurality of beam regions (91) forming on the surface of the plate, the method comprising: - providing a first plate-shaped body, wherein a surface side of the first body is provided with a first cut-out volume in accordance with a first design; - providing a second plate-shaped body, a surface side of the second body of which is provided with a second cut-out volume in accordance with a second design; - providing a plurality of slots (34) in the first and second plate-shaped bodies, the slots being arranged to be aligned with the beam regions on the surface of the plate with openings, and - connecting the surfaces of the first body and second body together so that the first cut-out volume and the second cut-out volume form a plurality of cooling channels in a composite body, the slots (34) being located between the cooling channels (94), the plurality of cooling channels having an inlet at connecting one side of the composite body to an outlet on another side of the composite body.
[18]
The method of claim 17, wherein the joining is performed by providing an adhesive layer between the surfaces of the first body and the second body.
[19]
The method of claim 17 or 18, wherein at least one of the first body and the second body comprises aluminum nitride.

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2019-05-08| PD| Change of ownership|Owner name: ASML NETHERLANDS B.V.; NL Free format text: DETAILS ASSIGNMENT: CHANGE OF OWNER(S), ASSIGNMENT; FORMER OWNER NAME: MAPPER LITHOGRAPHY IP B.V. Effective date: 20190425 |

优先权:

申请号 | 申请日 | 专利标题

US201261646398P| true| 2012-05-14|2012-05-14|

US201261646398|2012-05-14|

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